MWC Shanghai丨Tongxin Micro Delivers Keynote Speech at eSIM Summit

On June 30, the GSMA Summit and forums were held during the MWC Shanghai, where prominent figures and industry leaders from the global mobile ecosystem discussed the promising prospects and shared their industry insights under the themes of “5G Transformation,Digital Everything,Reality+ ”.Mr. John Zou, Executive Vice President of Tongxin Micro, delivered a keynote speech on "One Chip, One World ", introducing the strong integration and innovative application of Tongxin Micro's eSIM technology.

Driven by the 5G technology, a diversified pattern in mobile communication is gradually taking shape. After more than 20 years of efforts, Tongxin Micro has expanded its footprint into a variety of fields including SIM, eSIM, NFC-SIM, mobile eSE and other applications supporting digital identity and e-CNY. In particular, the SIM chip has benefited over 15 billion users worldwide. John Zou said: "We are striving to realize the digital experience of our "One Chip, One World " by launching the end-to-end eSIM solution together with our partner. Based on best-in-class chip hardware, this solution supports wafer-level personalized data writing, remote eSIM configuration and 5G connectivity. It has been certified by International CC EAL6+, GSMA SAS-UP and eSA, bringing seamless cross-border communication services to users.”

Global service

As the first Chinese eSIM total solution, it not only provides high-performance eSIM chip hardware and GSMA-compliant operating system, but also supports multiple LPAs based on Android/Linux/RTOS systems so as to download multiple profiles. John Zou said: "This year we received the GSMA SAS-UP certificate, which allows us to download the GSMA certificate at the wafer stage for secure personalized data writing. It means that we are able to provide fully GSMA-compliant eSIM products in China, which is helpful to advance the global deployment of the eSIM devices.”  

More than eSIM

As a wider range of functions are being integrated into mobile phones, more applications such as identity authentication, financial payment and device authentication will be packed into the security chip. The total eSIM solution developed by Tongxin Micro provides enough capacity to support applications with higher security requirements, in addition to consumer terminals and IoT terminals in the eSIM segment. Seamless connectivity in various scenarios such as mobile communication, shopping and driving will help expand the applications of eSIM technology thus creating a broader industry ecosystem. 

Seamless experience

"In order to improve experience and perception of users, MNOs and OEMs, we have optimized and enhanced the performance on the THD89 basis." said John Zou, "For example, this solution offers a threefold increase in profile download speed compared to the predecessor. 95% of eSIM activations worldwide can now be done by users themselves. The wafer-level personalized data writing allows eSIM chips to be packaged at the wafer level, significantly saving PCB board capacities and integrating more applications into devices.”

Eco-friendly

Moreover, this solution aligns with the concept of sustainable development. "According to ABI Research, more than 4 billion SIM cards were delivered in 2022. The eSIM solution adopting the wafer-level secure production can help effectively avoid plastic waste, reduce waste emissions, and minimize environmental impact through economies of scale, thus achieving the goals of both green environmental protection and economic development.

John Zou stated: “In the new era of Internet of Everything, Tongxin Micro will be more open-minded to further enrich application scenarios by collaborating with industry chain partners, and develop more opportunities and better experience for users. Our aim is to create a better world and brighten human life through the light of science and technology