Leading the New Trends in eSIM Technology, Tongxin Micro Attends the GSMA eSIM Ecosystem Cooperation Forum

On September 26, the "GSMA eSIM Ecosystem Cooperation Forum," organized by the Global System for Mobile Communications Association (GSMA), concluded successfully in Beijing. Tongxin Micro was invited to attend and shared valuable forward-thinking insights and frontier practices with representatives from various sectors of the eSIM value chain, including operators, device manufacturers, terminal module vendors, and solution providers. The forum focused on industry topics such as the latest advancements in eSIM technology, market trends, policy guidance, and business cooperation models.

With the further development of technologies like 5G and the IoT, eSIM has been widely applied in the consumer electronics sector and has shown enormous potential in smart home, IoT, and on-board devices. At the roundtable discussion, John Zou, Executive Vice President of Tongxin Micro, Lin Tianxiang, Vice President for OEM Sales at Thales Group Asia-Pacific, Zhu Tao, General Manager of the GTC Business Division at Fibocom, Peng Qinghua, CTO of Redtea Mobile, and Zhao Hao, Vice President of Honor China, engaged in deep discussions and exchanges on the latest developments in the eSIM technology ecosystem, as well as the opportunities and challenges encountered in its practical applications.

During the discussion on the development trends of eSIM technology, John Zou shared profound insights into the evolution of the technology. He stated that whether for an independent component like eSIM, an integrated NFC solution, or a potential Strong Box solution, security chips provide a reliable technical foundation for realizing their functionalities. As the application of eSIM technology becomes increasingly multifaceted in fields such as communication, payment, and transportation, the demand for integrated and discrete solutions in the market is becoming significantly more prominent. Therefore, offering a diversified product range, including both integrated and discrete solutions, will be the core strategy to meet market demands. Furthermore, as the integration of product functionalities increases, so do security risks and management complexities. As eSIM technology matures, integrated solutions will become the trend. However, during this development process, it will still be necessary to implement solutions in phases to balance functionality integration with risk management.

Tongxin Micro's eSIM business has expanded into the global consumer electronics and IoT markets. The company has launched several flexible and efficient eSIM products that comply with GSMA standards and China's domestic communication standards. The products provide storage capacities ranging from 512KB to 2MB, catering to the space requirements of various devices. In international markets, these eSIM products are widely used in consumer electronics such as smartphones and smartwatches, as well as in IoT devices like automobiles and CPE. In the domestic market, these eSIM products provide more convenient and cost-effective one-stop services for wearable devices, smart terminals, and other consumer electronics and IoT products. Tongxin Micro has collaborated with leading domestic smartphone manufacturers to adapt its eSIM products for global mobile terminals, and the eSIM products have now been successfully brought into commercial use.

In the wave of technological innovation, the communication industry is brimming with vitality. Moving forward, Tongxin Micro will collaborate with more partners to contribute to the global intelligent and digital ecosystem with smarter, more convenient, and more secure chip products and solutions, and to improve lives through the power of technology.