MWC Shanghai — Tongxin Micro eSIM Technology Vision: The Security Cornerstone of Intelligent Connectivity

Publication time:2025-09-26

On June 20, the 2025 MWC Shanghai World Mobile Communications Conference eSIM Summit officially opened. Mr. John Zou, Executive Vice President of Tongxin Micro, delivered a keynote speech entitled “eSIM Technology Outlook: The Secure Cornerstone of Intelligent Connectivity,” sharing the company’s comprehensive commercial achievements in eSIM and its technological blueprint of “eSIM: one chip, one world.” The presentation sparked widespread attention and lively discussion among industry clients, technical experts, and media attendees.

John Zou emphasized that eSIM, as a crucial enabler of real-time connectivity for terminal devices, will drive multi-dimensional industry transformation. For device manufacturers, eSIM allows OEMs to create slimmer, more waterproof products; for operators, it can effectively reduce operational costs and optimize business processes. For users, it offers convenient communication with seamless multi-number switching. From an ecosystem perspective, eSIM is accelerating the communications industry towards a greener, low-carbon future.

As a pioneer and builder of China’s eSIM industry, Tongxin Micro’s multi-category eSIM solutions have already been commercialized in numerous countries and regions worldwide. Compliant with the GSMA SGP22 V2.5 standard, these solutions support seamless switching among multiple global network formats and cover over 400+ operators around the world, having been successfully integrated by several well-known device manufacturers. They are widely used in mobile terminals, wearables, automotive electronics, IoT devices, and more, empowering the entire intelligent connectivity ecosystem. “This marks the first time a Chinese chip manufacturer has achieved large-scale international commercialization of eSIM, a milestone made possible by close collaboration across the entire industry chain.”

 “With the innovative convergence of frontier technologies such as 5G and AI, eSIM functionality will become ever more powerful and its applications increasingly diverse,” said John Zou. Drawing on deep insights into market and technological trends, Tongxin Micro has established a comprehensive strategic blueprint for eSIM products. Three major technical breakthroughs have been achieved: MEP (multiple profiles activated simultaneously) enables dynamic operator switching; the OS Patch mechanism ensures secure updates; and a multi-certificate system ensures compatibility with both GSMA international standards and Chinese commercial cryptographic algorithms. On the application level, the independence of eSIM is being fully leveraged: by overcoming SWP interface limitations and enhancing support for national cryptography, eSIM can now integrate contactless applications such as transit cards, bank cards, access control, as well as innovative services like CTID (online identity authentication) and e-CNY.

Faced with the trend of connectivity scenarios extending from the ground to the skies, Tongxin Micro will further expand the boundaries of eSIM technology—enabling not only conventional terrestrial network access, but also compatibility with satellite communication authentication and indoor WiFi certification. By building a trinity of “operator eSIM + satellite communication eSIM + WiFi,” the company aims to deliver seamless and highly reliable connectivity that addresses the communication needs of remote areas, high-altitude, maritime, and other challenging scenarios—enabling more consumers to soon experience the benefits of ubiquitous connectivity.

At this critical juncture in technological innovation, Tongxin Micro will continue to adhere to the corporate philosophy of “greater professionalism and continuous innovation,” conduct in-depth research into industry development trends and practical market needs, and work with upstream and downstream partners to develop more secure, reliable, high-performance eSIM solutions, thus driving the industry vision of “one chip, one world” ever closer to reality.

 

Tongxin Micro
  • Address:F/1, Building B-1, Zhongguancun Dongsheng Technology Park Northern Territory, No.66 Xixiaokou Road, Haidian District, Beijing
  • Phone:010-82351818-310
  • Zip code:100192
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