On June 20, the 2025 MWC Shanghai World Mobile
Communications Conference eSIM Summit officially opened. Mr. John Zou,
Executive Vice President of Tongxin Micro, delivered a keynote speech entitled
“eSIM Technology Outlook: The Secure Cornerstone of Intelligent Connectivity,” sharing
the company’s comprehensive commercial achievements in eSIM and its
technological blueprint of “eSIM: one chip, one world.” The presentation
sparked widespread attention and lively discussion among industry clients,
technical experts, and media attendees.
John Zou emphasized that eSIM, as a crucial enabler of
real-time connectivity for terminal devices, will drive multi-dimensional
industry transformation. For device manufacturers, eSIM allows OEMs to create
slimmer, more waterproof products; for operators, it can effectively reduce
operational costs and optimize business processes. For users, it offers
convenient communication with seamless multi-number switching. From an
ecosystem perspective, eSIM is accelerating the communications industry towards
a greener, low-carbon future.
As a pioneer and builder of China’s eSIM industry, Tongxin
Micro’s multi-category eSIM solutions have already been commercialized in
numerous countries and regions worldwide. Compliant with the GSMA SGP22
V2.5 standard, these solutions support seamless switching among multiple global
network formats and cover over 400+ operators around the world, having been
successfully integrated by several well-known device manufacturers. They are
widely used in mobile terminals, wearables, automotive electronics, IoT
devices, and more, empowering the entire intelligent connectivity
ecosystem. “This marks the first time a Chinese chip manufacturer has
achieved large-scale international commercialization of eSIM, a milestone
made possible by close collaboration across the entire industry chain.”
“With the
innovative convergence of frontier technologies such as 5G and AI, eSIM
functionality will become ever more powerful and its applications increasingly
diverse,” said John Zou. Drawing on deep insights into market and
technological trends, Tongxin Micro has established a comprehensive strategic
blueprint for eSIM products. Three major technical breakthroughs have been
achieved: MEP (multiple profiles activated simultaneously) enables dynamic
operator switching; the OS Patch mechanism ensures secure updates; and a
multi-certificate system ensures compatibility with both GSMA international
standards and Chinese commercial cryptographic algorithms. On the application
level, the independence of eSIM is being fully leveraged: by overcoming SWP
interface limitations and enhancing support for national cryptography, eSIM
can now integrate contactless applications such as transit cards, bank cards,
access control, as well as innovative services like CTID (online identity
authentication) and e-CNY.
Faced with the trend of connectivity scenarios extending
from the ground to the skies, Tongxin Micro will further expand the boundaries
of eSIM technology—enabling not only conventional terrestrial network access,
but also compatibility with satellite communication authentication and indoor
WiFi certification. By building a trinity of “operator eSIM + satellite
communication eSIM + WiFi,” the company aims to deliver seamless and highly
reliable connectivity that addresses the communication needs of remote areas,
high-altitude, maritime, and other challenging scenarios—enabling more
consumers to soon experience the benefits of ubiquitous connectivity.
At this critical juncture in technological innovation, Tongxin
Micro will continue to adhere to the corporate philosophy of “greater
professionalism and continuous innovation,” conduct in-depth research into
industry development trends and practical market needs, and work with upstream
and downstream partners to develop more secure, reliable, high-performance eSIM
solutions, thus driving the industry vision of “one chip, one world”
ever closer to reality.
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