World's First Open-Architecture Security Chip E450R Debuts at CIFTIS 2025

From September 10 to 14, 2025, the China International Fair for Trade in Services (CIFTIS) is being held in Beijing with great fanfare. As a leading provider of chips and solutions in the industry, Tongxin Micro has been invited to participate in this year’s financial services exhibition at CIFTIS, with a strong presence at two major pavilions. At the “Haidian—A High Ground for Technological and Financial Innovation, City with the Highest Investment Value” zone (Shougang Park, Pavilion 6, S6T013), as well as the “Postal Savings Bank of China” zone (Shougang Park, Pavilion 5, S5T009), Tongxin Micro is simultaneously showcasing collaborative achievements in cutting-edge applications of payment security chips. The company’s comprehensive displays highlight the distinctive Chinese ingenuity and innovative vitality embodied in the “UniChip,” contributing to deeper global cooperation in payment services.

At the exhibition, Tongxin Micro’s THD89-E450R—the world’s first open-architecture security chip—took center stage. Build on the open RISC-V architecture together with a flexible, customizable, and highly scalable design philosophy, this chip achieves a new benchmark in uniting security and performance.

In Pavilion 6, within the “Haidian—A High Ground for Technological and Financial Innovation, City with the Highest Investment Value” exhibition area, visitors experience the achievements of UniChip.

In terms of hardware architecture, the THD89-E450R adopts a new anti-tamper mechanism, an asymmetric cryptographic engine (PKE), and a non-volatile memory (NVM) management scheme. On the software side, it integrates an advanced virtual machine characterized by high performance and low resource consumption, delivering up to 50% higher transaction efficiency. This enables smoother payment experiences for users while supporting ISO/IEC international standard languages and cross-platform development environments, ensuring rapid development and broad compatibility in the global market.

At present, this chip and solutions have obtained a wide range of authoritative certifications, including China UnionPay Chip Security Certification, Embedded Software Security Certification, IC Card Operating System Certification, National Commercial Cryptography Grade II, and CCRC IT EAL5+ evaluations. Notably, it has been awarded China’s first “Financial Information Technology Product Assessment Certificate (Level 1 for Autonomous and Controllable Capability)” and saw its first commercial adoption in June this year with the launch of a bank card, establishing a benchmark for the large-scale application of secure open architectures in the financial sector.

Bank cards equipped with the THD89-E450R chip were showcased in Pavilion 5 at the “Postal Savings Bank of China” exhibition area.

As global digitalization continues apace and the integration of payment services with technological innovation deepens, Tongxin Micro will leverage its robust technical expertise and industrialization capabilities to continuously strengthen the foundation of digital trust—injecting more intelligent, more convenient, more secure and safe chip-powered strength into the high-quality development of the digital economy.

Exciting moments are underway. You are warmly invited to visit, experience, and exchange ideas on site!

Visitor Information:

Shougang Park, Beijing. Pavilion 6, “Haidian—A High Ground for Technological and Financial Innovation, City with the Highest Investment Value,” Booth No.: S6T013. Pavilion 5, “Postal Savings Bank of China” Exhibition Area, Booth No.: S5T009.