TMC’s Chip for Information Security Wins CITE Innovation Award

On August 14, the 8th China Information Technology Expo 2020 (CITE 2020) was opened in Shenzhen Convention & Exhibition Center. TMC showcased THD89 series of new-generation high-performance security chips. Thanks to world-class technological innovation and outstanding market performance, THD89 series outshined competitors to bag the CITE Innovation Award once again, demonstrating the prominent strength of TMC chips.

CITE 2020 is the largest electronic information expo covering the most complete components of the industry chain in Asia, but also a national platform for the latest products and technologies of the global electronic information industry. With significant influence in the international electronic information industry, CITE is deemed as a bellwether of the electronic information industry in China. CITE Innovation Award is highly valuable, and the candidates have to undergo strict review of the panel consisting of academicians and industry experts. The success of THD89 not only acknowledges TMC’s strong innovation capabilities and product attractiveness, but also recognizes the achievements of TMC’s chips.

As China's first chip certified by the high-assurance SOGIS CC EAL6+, THD989 supports both international and Chinese cryptographic algorithms, and adopts such technologies as memory encryption storage, bus encryption storage, electrical environment monitoring, anti-power analysis, and anti-fault injection. With up to 500,000 program/erase cycles and the data retention of as long as 25 years, THD89 is widely recognized in such fields as financial payment, mobile communications, automotive electronics, industrial internet and 5G, embodying the corporate mission of making information and connections more secure from multiple perspectives.

For the financial payment, Chinese banks including the six big state-owned banks, joint-stock banks and local commercial banks have massively issued financial IC cards with built-in THD89 chips. Meanwhile, TMC is actively exploring overseas markets, and THD89 becomes the first Chinese EMV-compliant chip supporting overseas massive card issuance. Regarding the automotive electronics, THD89 receives both the automotive-grade and financial-grade certificates. With rarely seen high security and high reliability, this product is speeding up the development of the intelligent vehicles. In terms of smart home, intelligent lock solutions with built-in THD89 have been successfully applied to different scenarios including households and apartments, strongly protecting the security of both information storage and communications.

In fact, after nearly two decades of evolutions and unremitting global exploration, TMC has become a true leader of security chips. The full range of products and solutions led by THD89 not only blaze secure and flexible development paths for such industry applications as eSIM, NFC-SIM, urban transportation and smart internet of things, but also garner strong momentums for the technological innovation in these fields.

According to the forecast of authoritative institutions, China’s IC market will keep a growth of 20.3%, with the sales in 2019 up 15.80% from a year earlier to RMB785.6bn. This number is expected to exceed RMB1 trillion by 2025. Meanwhile, as the central government plans to invest trillions of RMB in new infrastructure projects, the Chinese economy will be again on the high-quality development track. The IC industry, as the pillar of the electronic information industry, will embrace historic opportunities. Under this context, it's critical for Chinese and even global chip makers to enhance original innovation drivers and make breakthroughs in core technologies in order to realize sustainable development and stand out from the competition.

As a spearhead in China’s IC industry, TMC will advance with the times, insist on the innovation to drive technology R&D and application, and join hands with upstream and downstream partners to build a win-win chip future and a chip ecosystem by focusing on new digital applications and trends.