Tongxin Micro Shines at Electronica China: Pioneering Innovation in Security Chips and Automotive Electronics

Publication time:2024-07-10

On July 8, the 2024 Electronica China fair officially kicked off, bringing together over 1,600 excellent companies from around the globe. Spanning the full spectrum of the industry, from product design to implementation, this premier event is Asia-Pacific's top professional gathering for the electronics sector. As a leading provider of semiconductor solutions, Tongxin Micro was invited to participate in the event, where the company unveiled groundbreaking achievements in security chips and automotive electronics. These innovations drew widespread attention from government, industry, academia, and research sectors.

1. Twenty-Three Years of Expertise: Advancing Security Chip Technologies

Building on 23 years of R&D and production experience in the security chip sector, Tongxin Micro has consistently pioneered new frontiers with a range of innovative products. Featured prominently at the fair were the company's one-stop eSIM solutions, security MCU solutions, anti-counterfeit authentication solutions, and trusted computing solutions. As a key new product in the field of security authentication, the anti-counterfeit authentication solution emerged as a standout.

The solution has set a new benchmark in terms of security, reliability, and integration within the industry. It addresses the critical demand for cybersecurity in accessories and consumables. With industry-leading performance, it leverages state-of-the-art security authentication technology and a public key infrastructure (PKI) algorithm system. By utilizing the asymmetric properties of public and private keys, it employs digital certificate signing and verification to deliver highly secure anti-counterfeit authentication mechanisms. The solution supports multiple interfaces, compact packages, safe production, and one-stop services, making it ideal for applications such as wireless chargers, printer cartridges, device batteries, and hardware/software IP protection. It has already been adopted by leading manufacturers and entered mass production.

2. Accelerating Layout and Building a Comprehensive Automotive Chip Ecosystem

Tongxin Micro's "Automotive Chip Family" made a prominent appearance at the fair, showcasing automotive control chips, automotive security chips, power devices, and multiple terminal solutions. These products captivated numerous experts, scholars, media, and visitors who came to exchange ideas and explore.

Regarding automotive control chips, Tongxin Micro has achieved a major technological breakthrough by launching the first Arm Cortex-R52+ ASIL D MCU in China. This chip excels in real-time performance and multi-core capabilities, meeting the high safety requirements for applications in powertrain, chassis, body, and intelligent driving in both traditional fuel vehicles and new energy vehicles. It also supports new applications such as domain/zonal control units. As for automotive security chips, Tongxin Micro has developed a comprehensive suite of solutions, including an overall digital key solution ensuring vehicle-cloud-terminal security, an IoV security solution based on the first CC EAL6+ certified chip in China, and an on-board eSIM solution. These products have entered large-scale production with multiple OEMs and Tier-1 suppliers. In the field of power devices, Tongxin Micro's self-developed series of products feature advanced technology, supporting multiple package options while meeting requirements for high reliability and offering exceptional cost-effectiveness. Currently, Tongxin Micro's automotive chips are widely applied in key automotive areas such as engines, transmissions, main drive systems and BMS for new energy vehicles, drive-by-wire chassis, ZCU, ADAS domain control, digital keys, T-BOX, V2X, and gateways, continuously empowering the "new four modernizations" of the automotive industry.

From security chips to automotive electronics, Tongxin Micro's products have been employed across diverse scenarios, including finance, communications, government, transportation, education, and healthcare. With over 23 billion chips shipped to more than 20 countries and regions across Asia, Europe, the Americas, and Africa, the company's global footprint continues to expand. In the future, Tongxin Micro will continue to explore cutting-edge technologies and enrich its business ecosystem. By delivering smarter, more convenient, and more secure chip solutions, the company aims to support the development of smart cities worldwide, improving lives through the power of technology.

Tongxin Micro
  • Address:F/1, Building B-1, Zhongguancun Dongsheng Technology Park Northern Territory, No.66 Xixiaokou Road, Haidian District, Beijing
  • Phone:010-82351818-310
  • Zip code:100192
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