Tongxin Micro's Global Commercial Mobile Terminal eSIM Solution Shines at the MWC Shanghai 2024 eSIM Summit

On June 28, the eSIM Summit of the MWC Shanghai 2024 officially kicked off. Tongxin Micro showcased its Global Commercial Mobile Terminal eSIM Solution and, in collaboration with China Unicom, delivered a joint speech titled "AI Building the Future, eSIM Connecting the Infinite." Mr. John Zou, Executive Vice President of Tongxin Micro was invited to attend the "eSIM Summit – A New Era of Innovation," where he shared insights into innovative global commercial eSIM solutions and best practices, fully presenting domestic intelligent connectivity innovation achievements of the eSIM solution "One Chip Connecting the World." His presentation received widespread attention and heated discussion from industry customers, technical experts, and the media.

Global Commercial Application

With the integration of AI and 5G driving a surge in intelligent connectivity for mobile terminals. John Zou stated: "The intelligent connectivity of mobile terminals places higher demands on eSIM and terminal security. Tongxin Micro's eSIM solution is tailored for global mobile terminals. It is China's first eSIM solution to achieve commercial application in the domains of eSIM WLCSP package and GSMA SAS-UP wafer personalization. This marks a new era of global commercial application of domestic eSIM solutions."

The Global Commercial Mobile Terminal eSIM Solution showcased at the summit represents a crucial step in Tongxin Micro's push for the global deployment of eSIM technology. This solution offers global coverage across multiple countries and supports various network standards. It addresses key challenges, including non-standard SM-DP+ and operator IPP updates, that have hindered commercial deployment by overseas operators. It is efficiently compatible with terminal devices with different systems and LPAs worldwide and has been gradually implemented in mobile communication devices, wearable devices, automotive electronics, and IoT terminals across various regions. Devices featuring this solution are now commercially available globally.

Continuous Innovation

Tongxin Micro continues to drive the innovation and integration of cutting-edge eSIM technology, expanding its application scenarios and advancing its commercial progress. John Zou emphasized: "After 24 months of product preparation and 18 months of meticulous refinement for commercial application, this solution is not only compatible with different operating systems and LPA versions but also supports WLCSP package and meets personalized requirements such as custom eIDs, pre-configured profile management, and eSIM COS updates." The signing of a partnership agreement between Tongxin Micro and China Unicom Huasheng to establish a 5G eSIM Security Innovation Joint Laboratory provides strong support for enhancing eSIM product quality, broadening application scenarios, and driving solution innovation.

During the summit, John Zou joined Guo Lin, Deputy Director of the CTTL-Terminal Lab under the China Academy of Information and Communications Technology (CAICT), and Chen Fengwei, Deputy General Manager of China Unicom Huasheng, in a roundtable discussion on the future of eSIM technology. The participants highlighted how eSIM, as the underlying foundation of digitalization, will accelerate digital transformation across industries, bringing transformative changes to development models. They also emphasized that the integration of AI, eSIM, and smart terminals will unlock new possibilities, while trends toward greater integration, miniaturization, and lower power consumption will define the industry's future. eSIM technology offers significant advantages over traditional SIM cards. Throughout the summit, Tongxin Micro's exhibition booth attracted numerous industry professionals who engaged in in-depth consultations about application possibilities and explored new opportunities for the commercial use of eSIM technology.

With AI fueling the future, Tongxin Micro is committed to advancing global eSIM connectivity in collaboration with its partners worldwide, aiming to improve lives through the power of technology.