Tongxin Micro and iSOFT Infrastructure Software Reach Strategic Cooperation to Drive the Automotive Industry's "Chip" Vitality

On June 18, during the 2024 First China (Chongqing) Smart Automotive Basic Software Ecosystem Conference and the 3rd China Automotive Chip Summit Forum, Tongxin Microelectronics Co., Ltd. (hereinafter referred to as "Tongxin Micro") and iSOFT Infrastructure Software Co., Ltd. (hereinafter referred to as "iSOFT Infrastructure Software") officially signed a strategic cooperation agreement. The agreement was signed by Sheng Jinggang, Chief Engineer of Tongxin Micro, and Wang Qin, General Manager Assistant of iSOFT Infrastructure Software. Huang Jun, Senior Vice President of Tongxin Micro, and Chen Yunran, Deputy General Manager of iSOFT Infrastructure Software, were present to witness the signing ceremony.

According to the agreement, both parties will collaborate based on Tongxin Micro's high-performance automotive-grade MCU series and iSOFT Infrastructure Software's leading safety vehicle control operating system. They aim to create a more cost-effective integrated automotive MCU+OS solution and will further enhance their cooperation in the joint breakthroughs of domestic vehicle control system hardware and software to provide more competitive localized solutions for the automotive industry's future development.

Smart vehicles are an important carrier for the next generation of technological revolutions. Chips are the cornerstone for vehicles to achieve electrification and intelligence, while basic software underpins the ecosystem of intelligent vehicle applications and the automotive industry. The collaborative innovation of software and hardware will help accelerate the automotive industry's advancement to the "new four modernizations" (electrification, connectivity, intelligence, and shared mobility).

As the core company in the automotive electronics and intelligent chip segment of Tsinghua Unigroup, Tongxin Micro has leveraged its 23 years of experience in security chips, forming a business layout that integrates cybersecurity and functional safety as its foundation, while gradually introducing supporting products. It has launched several key products, including China's first ASIL D-certified high-end domain control MCU, which has completed 1 million km of road tests and been mass-produced for vehicles, the first Arm Cortex-R52+ ASIL D MCU in China, an overall digital key solution, an IoV security solution based on China's first CC EAL6+ certified chip, and automotive-grade power devices. These products are on par with those from international giants and are widely used in essential automotive fields, including engines, transmissions, main drive systems and BMS for new energy vehicles, drive-by-wire chassis, ZCU, ADAS domain control, digital keys, T-BOX, V2X, and gateways. They have earned recognition from many leading OEMs and Tier-1 suppliers.

As an important platform for China Electronics Technology Group Corporation (CETC) to develop basic software, iSOFT Infrastructure Software has been focusing on vehicle operating system technology for 16 years. It has independently developed the iSOFT automotive operating system platform and provides a full-lifecycle toolchain for vehicle software design, development, configuration, integration, and testing, as well as localized one-stop services and ecosystem support for automotive chips, to Chinese automotive manufacturers and component suppliers. The company has China's first AUTOSAR vehicle operating system product certified to the "Road vehicles – Functional safety" TÜV Rheinland ASIL D, which is the highest-level certification. By the end of 2023, it had achieved large-scale production of over 17 million units. The company's entire platform has achieved 100% autonomous controllability, with 7 authorized invention patents and 84 software copyrights. The platform has been widely validated by the market and is at an internationally advanced level.

With the establishment of a close, long-term, and stable strategic partnership, both parties will leverage their respective advantages to deepen cooperation in various areas, including control unit MCUs, vehicle basic software, integrated software-hardware solutions, customer project development, and collaborative development of the ecosystem chain, to jointly drive the high-quality growth of the automotive industry.