Tongxin Micro Participates in Bosch IP TechDay, Sharing Automotive Chip Technologies and Products Based on GTM IP

Publication time:2024-03-21

Recently, the first Bosch Asia-Pacific Semiconductor IP Technology Exchange Day was grandly held at Bosch (China) Investment Ltd. The event brought together industry elites from associations, OEMs, Tier-1 suppliers, semiconductor design companies, and IP toolchain providers. Tongxin Micro was invited to participate, with Zhang Zhang, Vice President and R&D Center General Manager, joining industry experts to discuss the next generation of CAN in-vehicle network communication protocols and GTM technology. The company also presented its latest application achievements based on GTM IP.


With the accelerated advancement to the "new four modernizations" in the automotive industry, the tasks undertaken by automotive chips have become increasingly complex, demanding higher performance and safety standards. IP cores provide powerful internal drivers for chips, and their performance and reliability directly impact the overall chip capability. It is crucial to develop automotive chip solutions that meet the requirements of future E/E architectures using mature and reliable chip IP.


"Tongxin Micro is the first semiconductor company in China to integrate GTM IP into automotive MCUs," said Zhang Zhang. "Our recently launched next-generation THA6 series MCUs incorporate Bosch's latest GTM IP version." The THA6 series MCUs feature up to six Arm Cortex-R52+ cores (with lock-step functionality), a clock speed of up to 400 MHz, a large-capacity embedded non-volatile memory, a self-developed SDK, and a microcontroller abstraction layer (MCAL). These capabilities address the high safety requirements of applications such as powertrain, chassis, body, and intelligent driving in both traditional fuel vehicles and new energy vehicles. The THA6 series also supports new applications such as domain/zonal control units.


In addition, this product has passed comprehensive testing and professional validation by the international authoritative certification body SGS. It has also received both the ASIL D functional safety process certification and ASIL D Product Ready certification. This provides an excellent software and hardware environment for new E/E architectures. The product, along with its vehicle control unit, electric drive control unit, and engine control unit solutions, attracted significant attention at the event.


"Beyond domain control MCUs, we have developed a series of highly competitive automotive chip products," Zhang Zhang highlighted. "For example, a one-stop digital key solution, an IoV security solution based on China's first CC EAL6+ certified chip, and automotive-grade power devices. These products have gained recognition from leading OEMs and renowned Tier-1 suppliers."


As the core company in the automotive electronics and intelligent chip segment of Tsinghua Unigroup, Tongxin Micro has formed a business layout centered on cybersecurity and functional safety while gradually covering supporting products. The company looks forward to continuing its collaboration with Bosch and other industry partners to explore automotive chip system architectures and technological development paths. The goal is to advance the secure implementation of smart vehicle scenarios and improve lives through the power of technology.

Tongxin Micro
  • Address:F/1, Building B-1, Zhongguancun Dongsheng Technology Park Northern Territory, No.66 Xixiaokou Road, Haidian District, Beijing
  • Phone:010-82351818-310
  • Zip code:100192
Technical Support
Follow us
Follow us